Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823911 | Process of package-then-etch three-dimensional package structure electrically connected by plated copper pillars | Haishen Kong, Jinxin Shen, Xinfu Liang, Qingyun Zhou | 2023-11-21 |
| 11217459 | Package-before-etch three-dimensional package structure electrically connected by plated copper pillars and process thereof | Haishen Kong, Jinxin Shen, Xinfu Liang, Qingyun Zhou | 2022-01-04 |
| 10763128 | Process of surface-mounting three-dimensional package structure electrically connected by prepackaged metal | Haishen Kong, Jinxin Shen, Xinfu Liang, Qingyun Zhou | 2020-09-01 |