Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6442043 | Chip assembly module of bump connection type using a multi-layer printed circuit substrate | Masahiro Kaizu | 2002-08-27 |
| 4730128 | Bias circuit for an avalanche photodiode | — | 1988-03-08 |
| 4603303 | Level compensation circuit | Keishi Matsuno, Masafumi Souma, Atsushi Minegishi | 1986-07-29 |