Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12415339 | Resin composition and metal clad substrate | Sheng Yen Wu, Meng-Han Yeh, Li-Chung Lu | 2025-09-16 |
| 10611910 | Halogen-free epoxy resin composition having low dielectric loss | Chun-Hao Chang, Yu-Chieh Hsu | 2020-04-07 |
| 10518503 | Laminated substrate | TA-YUAN YU, Yen-Hsing Wu | 2019-12-31 |