Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5104820 | Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | Joseph A. Minahan, Stuart N. Shanken | 1992-04-14 |
| 4983533 | High-density electronic modules - process and product | — | 1991-01-08 |
| 4912545 | Bonding of aligned conductive bumps on adjacent surfaces | — | 1990-03-27 |
| 4764846 | High density electronic package comprising stacked sub-modules | — | 1988-08-16 |
| 4706166 | High-density electronic modules--process and product | — | 1987-11-10 |