Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011450 | Preparation method of a ceramic module for power semiconductor integrated packaging | Zhaohui Wu, Wei Kang, Jun Zhang | 2021-05-18 |
| 10461016 | Ceramic module for power semiconductor integrated packaging and preparation method thereof | Zhaohui Wu, Wei Kang, Jun Zhang | 2019-10-29 |