Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9915005 | Additive C capable of changing microvia-filling method by TSV copper plating, and electroplating solution containing same | Su-Chee Simon Wang, Li Ma, Yanyan Li | 2018-03-13 |
| 9856572 | Additive for reducing voids after annealing of copper plating with through silicon via | Su-Chee Simon Wang, Li Ma, Yanyan Li | 2018-01-02 |