WZ

Wang Zhenliang

SC Stats Chippac: 1 patents #162 of 253Top 65%
📍 Hongmen, CN: #1 of 2 inventorsTop 50%
Overall (All Time): #2,940,949 of 4,157,543Top 75%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9627229 Semiconductor device and method of forming trench and disposing semiconductor die over substrate to control outward flow of underfill material Hoang Lan 2017-04-18