Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101158 | Wafer-scale membrane release laminates, devices and processes | Ari D. Brown, Joseph Oxborrow, Kevin L. Denis, Timothy Mark Miller | 2021-08-24 |
| 10923446 | Indium bump liftoff process on micro-machined silicon substrates | Ari D. Brown | 2021-02-16 |
| 9577177 | System and method for fabricating super conducting circuitry on both sides of an ultra-thin layer | Ari D. Brown | 2017-02-21 |