Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5885893 | Impact-free wire bonding of microelectronic devices | Coeyen Nee, Jeff Chang, C. James Hwang | 1999-03-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5885893 | Impact-free wire bonding of microelectronic devices | Coeyen Nee, Jeff Chang, C. James Hwang | 1999-03-23 |