Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12089331 | Metal circuit structure based on FPC and method of making the same | Cheng-Neng Chen, Yun-Nan Wang, Chiao-Hui Wang | 2024-09-10 |
| 11406018 | Double-sided and multilayer flexible printed circuit (FPC) substrate and method of processing the same | Cheng-Neng Chen, Yun-Nan Wang, Chih-Yuan Chao, Hsueh-Tsung Lu | 2022-08-02 |
| 8643794 | Heat-insulating film | — | 2014-02-04 |