Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12024788 | Bonding copper wire plated with palladium and gold and electroplating process thereof | Yi-Chun Liu, Baichuan Liu | 2024-07-02 |
| 7547397 | Particle-accelerating deposition and separation apparatus and method for turbid water | — | 2009-06-16 |