Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5075252 | Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction | — | 1991-12-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5075252 | Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction | — | 1991-12-24 |