Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10478984 | Chemically sharpening blades | Paul V. Pesavento, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz +2 more | 2019-11-19 |
| 10175499 | Camera assembly | James Howarth, Robin Eddington, Stephen Matthew Bunting, Richard R. Jenneke, Chee Keong Lai | 2019-01-08 |
| 10067357 | Integrated camera lens suspension | Mark A. Miller, Richard R. Jenneke | 2018-09-04 |
| 10036897 | Camera lens suspension with integrated electrical leads | Mark A. Miller | 2018-07-31 |
| 9935251 | LED chip packaging with high performance thermal dissipation | Keith D. Johnson, Michael W. Davis, Dean E. Myers, Douglas P. Riemer | 2018-04-03 |
| 9844888 | Chemically sharpening blades | Paul V. Pesavento, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz +2 more | 2017-12-19 |
| 9541769 | Integrated camera lens suspension | Mark A. Miller, Richard R. Jenneke | 2017-01-10 |
| 9454016 | Camera lens suspension with integrated electrical leads | Mark A. Miller | 2016-09-27 |
| 8941951 | Head suspension flexure with integrated strain sensor and sputtered traces | Jeffry S. Bennin, Jacob D. Bjorstrom, Paul V. Pesavento, Zachary A. Pokornowski | 2015-01-27 |
| 8296929 | Method for manufacturing an integrated lead suspension | Reed T. Hentges, Kurt C. Swanson, Lance Nevala | 2012-10-30 |
| 8144430 | Multi-layer ground plane structures for integrated lead suspensions | Reed T. Hentges, Kurt C. Swanson | 2012-03-27 |
| 7929252 | Multi-layer ground plane structures for integrated lead suspensions | Reed T. Hentges, Kurt C. Swanson, Lance Nevala | 2011-04-19 |
| 7832082 | Method for manufacturing an integrated lead suspension component | Reed T. Hentges, Kurt C. Swanson | 2010-11-16 |
| 7835112 | Integrated lead flexure with embedded traces | Reid C. Danielson, Steve Young | 2010-11-16 |
| 7579042 | Methods for the fabrication of thermally stable magnetic tunnel junctions | Y. Austin Chang, Jianhua Yang | 2009-08-25 |