| 11993405 |
Thermal control material |
Vladan Jankovic, Philip W. C. Hon, Luke Sweatlock, Mark William Knight, Shao-Hua Wu +3 more |
2024-05-28 |
| 11808526 |
Pressure-compensated thermal energy storage module |
Juan C. Garcia, Jack S Rechtin, Nadine Y. Kawabata |
2023-11-07 |
| 11800602 |
Multilayered metal nanowire array |
Jesse B. Tice, Max H. Kuciej |
2023-10-24 |
| 11264299 |
Direct write, high conductivity MMIC attach |
Jesse B. Tice, Steven J. Mass |
2022-03-01 |
| 11229090 |
Multilayered nanowire arrays with lateral interposers |
Jesse B. Tice, Max H. Kuciej |
2022-01-18 |
| 10180288 |
High-conductivity bonding of metal nanowire arrays |
John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Kenneth E. Goodson |
2019-01-15 |
| 9601452 |
High-conductivity bonding of metal nanowire arrays |
John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Kenneth E. Goodson |
2017-03-21 |
| 9468989 |
High-conductivity bonding of metal nanowire arrays |
John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Kenneth E. Goodson |
2016-10-18 |
