Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12262464 | Methods for forming engineered thermal paths of printed circuit boards by use of removable layers | Michael Len, King Yip Leung | 2025-03-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12262464 | Methods for forming engineered thermal paths of printed circuit boards by use of removable layers | Michael Len, King Yip Leung | 2025-03-25 |