Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6222739 | High-density computer module with stacked parallel-plane packaging | Jayesh R. Bhakta | 2001-04-24 |
| 6160718 | Multi-chip package with stacked chips and interconnect bumps | — | 2000-12-12 |
| 6094355 | High-density computer modules with double-layer packaging | — | 2000-07-25 |