Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4891069 | Composition for the electrolytic coating of circuit boards without an electroless metal coating | Abrahm M. Holtzman | 1990-01-02 |
| 4882202 | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits | Abraham M. Holtzman | 1989-11-21 |
| 4816070 | Use of immersion tin and alloys as a bonding medium for multilayer circuits | Abraham M. Holtzman | 1989-03-28 |
| 4790912 | Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating | Abraham M. Holtzman | 1988-12-13 |
| 4715894 | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits | Abraham M. Holtzman | 1987-12-29 |
| 4657632 | Use of immersion tin coating as etch resist | Abraham M. Holtzman | 1987-04-14 |