JA

John M. Altendorf

HP HP: 16 patents #3,523 of 16,619Top 25%
Overall (All Time): #302,189 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6779869 Printhead nozzle alignment in a printing system Jeffrey T. Hendricks, Si-lam Choy, Ronald A. Hellekson 2004-08-24
6764165 Fluid ejection device and method of manufacturing a fluid ejection device Christopher C. Aschoff, William Boucher, Paul F. Reboa, Gilbert G. Smith 2004-07-20
6722756 Capping shroud for fluid ejection device Si-lam Choy, Carl L. Baker, Yi Feng 2004-04-20
6557990 Evacuated structures for removing accumulated air 2003-05-06
6286950 Inkjet storage container sealing mechanism Winthrop D. Childers 2001-09-11
6183072 Seal using gasket compressed normal to assembly axis of two parts 2001-02-06
6042225 Ink-jet pen with one-piece pen body Joseph R. Elliot, Mark Huth 2000-03-28
5969739 Ink-jet pen with rectangular ink pipe Joseph R. Elliot, Melissa D. Boyd, Kenneth L. Christensen, Julie Jo Bostater, Brian D. Gragg +1 more 1999-10-19
5917527 Ink-jet pen with near net size porous member Patrick V. Boyd, Mark Huth, Joseph R. Elliot 1999-06-29
5671001 Leak resistant ink containment for a printer Joseph R. Elliot, J. Paul Harmon, Naoto Kawamura 1997-09-23
5659345 Ink-jet pen with one-piece pen body 1997-08-19
D373381 Print cartridge Joseph R. Elliot 1996-09-03
5526030 Pressure control apparatus for an ink pen Marc A. Baldwin, Ella M. Duyck, Mark McCarty, Lowell R. McDaniel, Joseph R. Elliot +1 more 1996-06-11
5363130 Method of valving and orientation sensitive valve including a liquid for controlling flow of gas into a container Bruce Cowger, David J. Halko, Marc A. Baldwin 1994-11-08
5092034 Soldering interconnect method for semiconductor packages Marvin Glenn Wong 1992-03-03
5005070 Soldering interconnect method and apparatus for semiconductor packages Marvin Glenn Wong 1991-04-02