Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12416490 | Method and chemical mechanical planarization device for in-situ measurement of film thickness | Weitao Meng, Jile Jiang | 2025-09-16 |
| 12397394 | Method and device for determining parameters of near-surface dielectric layer in wafer grinding scene | Jile Jiang, Weitao Meng | 2025-08-26 |