Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5633069 | Multilayer printed-circuit substrate, wiring substrate and process of producing the same | Masakazu Shimizu, Hiroshi Shimamura | 1997-05-27 |
| 5573632 | Multilayer printed-circuit substrate, wiring substrate and process of producing the same | Masakazu Shimizu, Hiroshi Shimamura | 1996-11-12 |