HB

Havyn E. Bradley

HP HP: 2 patents #2,312 of 7,018Top 35%
📍 Fort Collins, CO: #1,590 of 3,421 inventorsTop 50%
🗺 Colorado: #17,029 of 40,980 inventorsTop 45%
Overall (All Time): #2,260,235 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5750422 Method for making integrated circuit packaging with reinforced leads Louis T. Mills, Richard M. Butler 1998-05-12
5281851 Integrated circuit packaging with reinforced leads Louis T. Mills, Richard M. Butler 1994-01-25