Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 4500033 | Method for expelling entrapped air from reactive metallic layups prior to diffusion bonding | David W. Schulz | 1985-02-19 | $3,287,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 4500033 | Method for expelling entrapped air from reactive metallic layups prior to diffusion bonding | David W. Schulz | 1985-02-19 | $3,287,000 |