Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6724083 | Method of producing semiconductor packages by cutting via holes into half when separating substrate | Tsutomu Ohuchi | 2004-04-20 |
| 6566747 | Semiconductor package and production method thereof | Tsutomu Ohuchi | 2003-05-20 |