Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869908 | Photosensitive chip package structure, camera module, and mobile terminal | Atsushi Yajima, Kun RAN, Lifeng Fu, Weichih Lin, Changfu Huang | 2024-01-09 |
| 11102384 | Camera substrate assembly, camera module, and terminal device | Guanghai Wang, Cunying Li, Qingshan Tian, Jianwen Wang, Sheng Li | 2021-08-24 |