Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638847 | Method of forming lead-free bump interconnections | Edwin Cheung | 2003-10-28 |
| 6501185 | Barrier cap for under bump metal | Yeung Ming Chow | 2002-12-31 |
| 6413851 | Method of fabrication of barrier cap for under bump metal | Yeung Ming Chow | 2002-07-02 |