Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412803 | Lid allowing for a thermal interface material with fluidity in a lidded flip chip package | — | 2025-09-09 |
| 12381125 | Structural screen window liquid metal thermal interface pad | — | 2025-08-05 |
| 12040251 | 3D cooling block for heat dissipation in electronic devices | — | 2024-07-16 |
| 11507017 | Package aspect of heat-dissipating lid and reservoir structure for liquid thermal interfacing materials | — | 2022-11-22 |
| 11373931 | Lid allowing for liquid metal thermal interfacing materials in a lidded flip chip package | — | 2022-06-28 |
| 11296010 | Heat sink aspect of heat dissipating lid and reservoir structure flip chip package for liquid thermal interfacing materials | — | 2022-04-05 |
| 11177193 | Reservoir structure and system forming gap for liquid thermal interface material | — | 2021-11-16 |
| 10685851 | Hybrid-cloth-based method for making TSV substrates | — | 2020-06-16 |
| 10643924 | Heat-dissipating lid with reservoir structure and associated lidded flip chip package allowing for liquid thermal interfacing materials | — | 2020-05-05 |
| 9397035 | Integrated ingot for TSV substrates and method for making the same | — | 2016-07-19 |