Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967469 | Electronic component configured to relax internal stresses due to changes in temperature and manufacturing method of the same | Hajime Kuwajima, Takashi Ohtsuka, Takeshi Oohashi | 2024-04-23 |
| 11776947 | Electronic component and manufacturing method therefor | Yusuke OBA, Kenichi Yoshida, Takashi Ohtsuka, Tomoya Hanai, Yu FUKAE | 2023-10-03 |
| 11545303 | Electronic component and its manufacturing method | Kazuhiro Yoshikawa, Kenichi Yoshida, Takashi Ohtsuka, Takeshi Oohashi, Hajime Kuwajima | 2023-01-03 |
| 11515854 | LC composite component | Yoshihiro Shinkai, Yusuke ARIAKE, Tomoya Hanai, Isao Kanada, Takashi Ohtsuka | 2022-11-29 |
| 11452209 | Electronic component and its manufacturing method | Takeshi Oohashi, Hajime Kuwajima, Takashi Ohtsuka, Kazuhiro Yoshikawa, Kenichi Yoshida | 2022-09-20 |
| 11328872 | LC composite component | Yoshihiro Shinkai, Tomoya Hanai, Yusuke ARIAKE, Isao Kanada, Takashi Ohtsuka | 2022-05-10 |
| 10426032 | Multilayer wiring structure and its manufacturing method | Hajime Kuwajima, Tomonaga Nishikawa, Takashi Ohtsuka, Takeshi Oohashi, Manabu Yamatani | 2019-09-24 |
| 7650120 | High frequency module | Hideya Matsubara, Masashi Iwata | 2010-01-19 |
| 7565116 | High frequency module | Hideya Matsubara, Shinya Nakai, Masashi Iwata | 2009-07-21 |
| 7471930 | High frequency module | Hideya Matsubara, Masashi Iwata | 2008-12-30 |
| 7463115 | High frequency electronic component | — | 2008-12-09 |
| 7412210 | High frequency module | — | 2008-08-12 |
| 7388453 | High frequency module | Hideya Matsubara, Masami Itakura, Masashi Iwata | 2008-06-17 |