Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6117930 | Resin systems for organosilicon-containing compositions | My N. Nguyen | 2000-09-12 |
| 5612403 | Low temperature flexible die attach adhesive and articles using same | My N. Nguyen | 1997-03-18 |
| 5489637 | Low temperature flexible die attach adhesive and articles using same | My N. Nguyen | 1996-02-06 |
| 5399907 | Low temperature flexible die attach adhesive and articles using same | My N. Nguyen | 1995-03-21 |
| 5250600 | Low temperature flexible die attach adhesive and articles using same | My N. Nguyen | 1993-10-05 |