Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288742 | Packaging substrate and semiconductor apparatus comprising same | Sungjin Kim, Jincheol KIM, Byungkyu Jang | 2025-04-29 |
| 12198994 | Packaging substrate and method for manufacturing same | Sungjin Kim, Jincheol KIM, Byungkyu Jang | 2025-01-14 |
| 12165979 | Packaging substrate and semiconductor apparatus comprising same | Sungjin Kim, Jincheol KIM, Byungkyu Jang | 2024-12-10 |
| 12027454 | Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same | Sungjin Kim, Jincheol KIM | 2024-07-02 |
| 11981501 | Loading cassette for substrate including glass and substrate loading method to which same is applied | Sungjin Kim, Jincheol KIM, Byungkyu Jang | 2024-05-14 |
| 11967542 | Packaging substrate, and semiconductor device comprising same | Sungjin Kim, Jincheol KIM, Byungkyu Jang | 2024-04-23 |
| 11728259 | Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same | Sungjin Kim, Jincheol KIM | 2023-08-15 |
| 11652039 | Packaging substrate with core layer and cavity structure and semiconductor device comprising the same | Sungjin Kim, Jincheol KIM, Byungkyu Jang | 2023-05-16 |
| 11469167 | Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same | Sungjin Kim, Jincheol KIM | 2022-10-11 |
| 11437308 | Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatus | Sungjin Kim, Jincheol KIM | 2022-09-06 |