YM

Youichi Matsuo

KA Kaneka: 5 patents #246 of 1,525Top 20%
IC Idemitsu Petrochemical Co.: 4 patents #94 of 578Top 20%
NE Nec: 2 patents #5,510 of 14,502Top 40%
Honda Motor Co.: 1 patents #12,035 of 21,052Top 60%
Mitsubishi Electric: 1 patents #15,491 of 25,717Top 65%
Overall (All Time): #363,702 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12319815 Resin composition, method for producing same, and multi-liquid curable resin composition Hiroki Fukaumi, Shinji Kagitani 2025-06-03
12312494 Resin composition, method for producing same, and multi-liquid curable resin composition Hiroki Fukaumi, Shinji Kagitani 2025-05-27
10563088 Photocurable and thermosetting resin composition, cured product, and laminate Hiroki Fukaumi, Atsushi Tsukao 2020-02-18
10227505 Active energy ray-curable composition Hiroki Fukaumi, Atsushi Tsukao, Shinji Kagitani 2019-03-12
10131810 Active energy-ray-curable resin composition for coating organic or inorganic substrate Atsushi Tsukao 2018-11-20
8815989 Resin composition for coating material Takahiro Saito, Shinji Kagitani 2014-08-26
6890494 Method for polymerization of olefin Hideki Satou, Itaru Matsuhiro 2005-05-10
6867252 Propylene resin composition and interior automotive member comprising the same Ryuzo Tomomatsu, Naoki Narukawa, Tetsushi Yamada, Tetsuya Oda 2005-03-15
6559829 Flat display device and fixing member for display unit Tadami Takehara, Seiji Matsumura, Kan'ichirou Ishibashi 2003-05-06
6271318 Method for polymerization of olefin Hideki Satou, Itaru Matsuhiro 2001-08-07
5556820 Catalyst component for olefin polymerization and process for producing polyolefins Hideo Funabashi, Akinobu Sugahara, Akira Tanaka, Masatoshi Toda, Tsuyoshi Ota +3 more 1996-09-17
4854377 Liquid cooling system for integrated circuit chips Mitsuo Komoto, Toshifumi Sano 1989-08-08
4703339 Package having a heat sink suitable for a ceramic substrate 1987-10-27