Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894284 | Semiconductor structure having silver-indium transient liquid phase bonding joint | Chin Chung Lee | 2024-02-06 |
| 11373925 | Silver-indium transient liquid phase method of bonding semiconductor device and heat-spreading mount and semiconductor structure having silver-indium transient liquid phase bonding joint | Chin Chung Lee | 2022-06-28 |