Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218094 | Electronic package structure and method for manufacturing the same | Wei Wang, Tung Yao LIN | 2025-02-04 |
| 11935855 | Electronic package structure and method for manufacturing the same | Wei Wang, Tung Yao LIN | 2024-03-19 |
| 11817421 | Method for manufacturing semiconductor package structure | Tung Yao LIN, Rong He GUO | 2023-11-14 |
| 11652081 | Method for manufacturing semiconductor package structure | Tung Yao LIN, Rong He GUO | 2023-05-16 |