Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12196323 | Sealing mechanism | Wei-Kai Hsiao | 2025-01-14 |
| 8559170 | Motherboard assembly and central processing unit expansion card | YI-CHENG TSENG, Chun-Hsien Tsai, Feng-Ming Chang | 2013-10-15 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12196323 | Sealing mechanism | Wei-Kai Hsiao | 2025-01-14 |
| 8559170 | Motherboard assembly and central processing unit expansion card | YI-CHENG TSENG, Chun-Hsien Tsai, Feng-Ming Chang | 2013-10-15 |