Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119308 | Packaging structure of semiconductor chip and formation method thereof | Honghui Wang | 2024-10-15 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119308 | Packaging structure of semiconductor chip and formation method thereof | Honghui Wang | 2024-10-15 |