Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553514 | Substrate strip including conductive plane around periphery of chip mounting regions and method of manufacturing semiconductor package using the same | Keung Beum Kim, Dongsuk Kim, Yonghoon Kim | 2020-02-04 |
| 8921163 | Semiconductor packages and methods of fabricating the same | Sangwook Park, Jonggi Lee | 2014-12-30 |
| 8456018 | Semiconductor packages | Sangwook Park, Jonggi Lee | 2013-06-04 |