Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495915 | Flip chip package of monolithic microwave integrated circuit | Tsung-Ying Hsieh, Chin-Lien Hsu | 2002-12-17 |
| 6483186 | High power monolithic microwave integrated circuit package | Tsung-Ying Hsieh, Chin-Lien Hsu | 2002-11-19 |