Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8723313 | Semiconductor package structure and method for manufacturing the same | — | 2014-05-13 |
| 7968446 | Metallic bump structure without under bump metallurgy and manufacturing method thereof | — | 2011-06-28 |
| 7733627 | Structure of embedded capacitor | — | 2010-06-08 |
| 7713860 | Method of forming metallic bump on I/O pad | — | 2010-05-11 |
| 7713861 | Method of forming metallic bump and seal for semiconductor device | — | 2010-05-11 |