Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6474355 | Particle removing vacuum system for assembly of FBGA packages | Kasin Jirawat, Chuawalit Klanruengsang, Khanchit Suphanpesat | 2002-11-05 |
| 6415975 | Determination of quality of bonding between a conductive ball and a conductive pad within an IC package | Prakorn Vijchulata | 2002-07-09 |
| 6193134 | Determination of quality of bonding between a conductive ball and a conductive pad within an IC package | Prakorn Vijchulata | 2001-02-27 |
| 6062459 | Wire bond clamp | — | 2000-05-16 |
| 6028350 | Lead frame with strip-shaped die bonding pad | — | 2000-02-22 |