Issued Patents All Time
Showing 25 most recent of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096547 | Metallic interconnects products | — | 2018-10-09 |
| 9911614 | Methods for activating openings for jets electroplating | — | 2018-03-06 |
| 9673090 | Seed layers for metallic interconnects | — | 2017-06-06 |
| 9530653 | High speed electroplating metallic conductors | — | 2016-12-27 |
| 9278890 | Continuous process for manufacturing freely flowing solid acidic P/K fertilizer | Talia Aviv, Doron Orgil, Itsik Aroch | 2016-03-08 |
| 9273409 | Electroplated metallic conductors | — | 2016-03-01 |
| 9216930 | Continuous process for manufacturing a neutral granular P/K fertilizer | Talia Aviv, Doron Orgil, Itsik Aroch | 2015-12-22 |
| 9161272 | Method and apparatus to achieve lossless call in view of a temporary reception issue | Gabi Ofir, David Bar-On | 2015-10-13 |
| 8685221 | Enhanced electrochemical deposition filling | — | 2014-04-01 |
| 8603242 | Floating semiconductor foils | Michael Roitberg | 2013-12-10 |
| 8586471 | Seed layers for metallic interconnects and products | — | 2013-11-19 |
| 8501139 | Floating Si and/or Ge foils | — | 2013-08-06 |
| 8349149 | Apparatus for enhanced electrochemical deposition | — | 2013-01-08 |
| 8123861 | Apparatus for making interconnect seed layers and products | — | 2012-02-28 |
| 7709958 | Methods and structures for interconnect passivation | — | 2010-05-04 |
| 7682496 | Apparatus for depositing seed layers | — | 2010-03-23 |
| 7573133 | Interconnect structures and methods for their fabrication | — | 2009-08-11 |
| 7550386 | Advanced seed layers for interconnects | — | 2009-06-23 |
| 7282445 | Multiple seed layers for interconnects | — | 2007-10-16 |
| 7247563 | Filling high aspect ratio openings by enhanced electrochemical deposition (ECD) | — | 2007-07-24 |
| 7199052 | Seed layers for metallic interconnects | — | 2007-04-03 |
| 7105434 | Advanced seed layery for metallic interconnects | — | 2006-09-12 |
| 6924226 | Methods for making multiple seed layers for metallic interconnects | — | 2005-08-02 |
| 6903016 | Combined conformal/non-conformal seed layers for metallic interconnects | — | 2005-06-07 |
| 6869515 | Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings | — | 2005-03-22 |