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TSAN-LIEN YEH

SM Sigurd Microelectronics: 1 patents #3 of 8Top 40%
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Patent #TitleCo-InventorsDate
9831197 Wafer-level package with metal shielding structure and the manufacturing method thereof Kuan-Tien Shen, Szu-Chuan Pang, Wei Wang 2017-11-28