Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8897027 | Bonding pad structure | Han-Chung Chen, Chun-Yi Wu, Shih-Cheng Wang, Chin-Mei Huang, Pei-Fang Tsai | 2014-11-25 |
| 7667141 | Flexible printed circuit layout and method thereof | Ying Xu, Ning Li, Chin-Mei Huang | 2010-02-23 |