Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538269 | Optical fingerprint sensor for LCD panel | Wei-Ping Chen | 2022-12-27 |
| 11280988 | Structure light module using vertical cavity surface emitting laser array and folding optical element | Wei-Ping Chen, Jau-Jan Deng | 2022-03-22 |
| 10469718 | Camera module having baffle between two glass substrates | Wei-Ping Chen | 2019-11-05 |
| 10455131 | Wafer-level methods for packing camera modules, and associated camera modules | Wei-Ping Chen | 2019-10-22 |
| 10437025 | Wafer-level lens packaging methods, and associated lens assemblies and camera modules | Wei-Ping Chen, Jui-Yi Chiu, Jau-Jan Deng | 2019-10-08 |
| 10333277 | Structure light module using vertical cavity surface emitting laser array | Wei-Ping Chen | 2019-06-25 |
| 10122903 | Bezels for die level packaging of camera modules, and associated camera modules and methods | Wei-Ping Chen | 2018-11-06 |
| 10075636 | Ultra-small camera module with wide field of view, and associate lens systems and methods | Ting-Yu Cheng, Wei-Ping Chen, Chuen-Yi Yin | 2018-09-11 |
| 9915763 | Stacked-lens assembly and fabrication method for same | Wei-Ping Chen | 2018-03-13 |
| 9902120 | Wide-angle camera using achromatic doublet prism array and method of manufacturing the same | Wei-Ping Chen, Jau-Jan Deng, Chuen-Yi Yin | 2018-02-27 |
| 9804367 | Wafer-level hybrid compound lens and method for fabricating same | Wei-Ping Chen | 2017-10-31 |
| 9467606 | Wafer level stepped sensor holder | Jau-Jan Deng, Wei-Ping Chen | 2016-10-11 |
| 9451137 | PCB-mountable lens adapter for a PCB-mountable camera module | Wei-Ping Chen | 2016-09-20 |
| 9386203 | Compact spacer in multi-lens array module | Wei-Ping Chen, Jui-Yi Chiu | 2016-07-05 |
| 9349765 | Suspended lens system having a non-zero optical transmission substrate facing the concave surface of a single-piece lens and wafer-level method for manufacturing the same | Wei-Ping Chen | 2016-05-24 |