Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11608433 | Formulation and processing solution for dicing process, and method for processing | Masafumi Hirose, Yuta Akutsu | 2023-03-21 |
| 10700016 | Protective film material for laser processing and wafer processing method using the protective film material | Masafumi Hirose, Daisuke Tomita | 2020-06-30 |
| 9502295 | Protective film material for laser processing and wafer processing method using the protective film material | Masaaki Shinjo, Yoshimasa Takeuchi, Masafumi Hirose | 2016-11-22 |