Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10186447 | Method for bonding thin semiconductor chips to a substrate | Philip Ekkels | 2019-01-22 |
| 8658512 | Method for forming MEMS variable capacitors | Geert Altena, Martijn Goedbloed, Robert Puers | 2014-02-25 |