Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D980980 | Acupuncture needle with a coil handle | — | 2023-03-14 |
| D921897 | Acupuncture needle | — | 2021-06-08 |
| 8380298 | Magnetic acupuncture needle | — | 2013-02-19 |
| 8226540 | Acupuncture needle with magnetized handle | — | 2012-07-24 |
| 7174230 | Computer integrated manufacturing techniques | John F. Arackaparambil, Billy Chow, Patrick M. D'Souza, Parris Hawkins, Charles Huang +8 more | 2007-02-06 |
| 7069101 | Computer integrated manufacturing techniques | John F. Arackaparambil, Billy Chow, Patrick M. D'Souza, Parris Hawkins, Charles Huang +8 more | 2006-06-27 |
| 5705432 | Process for providing clean lift-off of sputtered thin film layers | Kusol Lee, Tom Quach, Danny Li, Liping D. Hou, Sam Chung | 1998-01-06 |
| 5556797 | Method of fabricating a self-aligned double recess gate profile | Liping D. Hou, Kusol Lee, Danny Li, Ishver K. Naik, Tom Quach | 1996-09-17 |
| 5539228 | Field-effect transistor with high breakdown voltage provided by channel recess offset toward drain | — | 1996-07-23 |
| 5436201 | Dual etchant process, particularly for gate recess fabrication in GaAs MMIC chips | Danny Li, Liping D. Hou, Tom Quach | 1995-07-25 |
| 5378926 | Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal nitride barrier layer to block migration of tin through via holes | Brook Raymond | 1995-01-03 |
| 5350662 | Maskless process for forming refractory metal layer in via holes of GaAs chips | — | 1994-09-27 |
| 5283452 | Distributed cell monolithic mircowave integrated circuit (MMIC) field-effect transistor (FET) amplifier | Yi-Chi Shih, David C. Wang, Huy Le, Vincent Hwang | 1994-02-01 |
| 5156998 | Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes | Brook Raymond | 1992-10-20 |