TF

Ting Yu Fu

SC Stats Chippac: 2 patents #282 of 425Top 70%
Overall (All Time): #2,016,574 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9478513 Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate Jen-Yu Chen, Men Hsien Li, CHIEN-CHEN LEE 2016-10-25
8741764 Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate Jen-Yu Chen, Men Hsien Li, CHIEN-CHEN LEE 2014-06-03