| 7372334 |
Output match transistor |
Cindy Blair, Tan Pham, Nagaraj Dixit |
2008-05-13 |
| 6818951 |
Arrangement in a power mosfet |
Nils Af Ekenstam, Jan Johansson, Timothy Ballard, Gary Lopes, Michael Peternel |
2004-11-16 |
| 6791419 |
Constant gain, constant phase RF power block |
William Hart, James Mogel, Robert Bartola |
2004-09-14 |
| 6614308 |
Multi-stage, high frequency, high power signal amplifier |
Larry Leighton, Prasanth Perugupalli |
2003-09-02 |
| 6515235 |
Liquid dielectric tuning of an integrated circuit |
— |
2003-02-04 |
| 6429510 |
Liquid damping of high frequency bond wire vibration |
— |
2002-08-06 |
| 6414389 |
Alignment pedestals in an LDMOS power package |
Jeff Hume, Henrik Hoyer |
2002-07-02 |
| 6392298 |
Functional lid for RF power package |
Larry Leighton, Bengt Ahl, Henrik Hoyer |
2002-05-21 |
| 6181006 |
Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink |
Bengt Ahl, Larry Leighton |
2001-01-30 |
| 6160710 |
Capacitive mounting arrangement for securing an integrated circuit package to a heat sink |
Bengt Ahl, Larry Leighton |
2000-12-12 |
| 5982000 |
Resistive interconnect of transistor cells |
Larry Leighton, Nils af Ekenstam, Jan Johansson |
1999-11-09 |
| 5933327 |
Wire bond attachment of a integrated circuit package to a heat sink |
Larry Leighton, Bengt Ahl |
1999-08-03 |
| 5889319 |
RF power package with a dual ground |
Larry Leighton |
1999-03-30 |
| 5877555 |
Direct contact die attach |
Larry Leighton |
1999-03-02 |
| 5869897 |
Mounting arrangement for securing an intergrated circuit package to heat sink |
Larry Leighton, Bengt Ahl |
1999-02-09 |
