Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8288200 | Semiconductor devices with conductive clips | — | 2012-10-16 |
| 7960209 | Semiconductor device assembly process | Jiang Xiaolan | 2011-06-14 |
| 7834433 | Semiconductor power device | Li Yunfang | 2010-11-16 |
| 7786555 | Semiconductor devices with multiple heat sinks | — | 2010-08-31 |
| 7682874 | Chip scale package (CSP) assembly apparatus and method | Li Yunfang | 2010-03-23 |
| 7402459 | Quad flat no-lead (QFN) chip package assembly apparatus and method | Li Yunfang | 2008-07-22 |
| 7264999 | Semiconductor device with interlocking clip | Shi Jingping | 2007-09-04 |
| 7095113 | Semiconductor device with interlocking clip | Shi Jingping | 2006-08-22 |