Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12048102 | Electronic circuit production method using 3D layer shaping | Ryojiro Tominaga, Kenji Tsukada, Ryo SAKAKIBARA | 2024-07-23 |
| 11945886 | Cured resin formation method and cured resin formation device | Ryojiro Tominaga | 2024-04-02 |
| 11006529 | Circuit forming method | Kenji Tsukada, Masatoshi Fujita, Yoshitaka Hashimoto, Akihiro Kawajiri, Masato Suzuki +1 more | 2021-05-11 |