TO

Tae S. Oh

IBM: 3 patents #26,272 of 70,183Top 40%
Overall (All Time): #1,642,316 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5599582 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Terrence R. O'Toole, Sampath Purushothaman +4 more 1997-02-04
5582858 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Terrence R. O'Toole, Sampath Purushothaman +4 more 1996-12-10
5326643 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Terrence R. O'Toole, Sampath Purushothaman +4 more 1994-07-05